JPS6350094A - 多層回路基板の製造方法 - Google Patents
多層回路基板の製造方法Info
- Publication number
- JPS6350094A JPS6350094A JP19416786A JP19416786A JPS6350094A JP S6350094 A JPS6350094 A JP S6350094A JP 19416786 A JP19416786 A JP 19416786A JP 19416786 A JP19416786 A JP 19416786A JP S6350094 A JPS6350094 A JP S6350094A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wiring board
- layer
- board
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000010410 layer Substances 0.000 claims description 47
- 239000000919 ceramic Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000009719 polyimide resin Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 239000011229 interlayer Substances 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 15
- 229910052737 gold Inorganic materials 0.000 description 15
- 239000010931 gold Substances 0.000 description 15
- 238000007747 plating Methods 0.000 description 8
- 230000007547 defect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19416786A JPS6350094A (ja) | 1986-08-20 | 1986-08-20 | 多層回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19416786A JPS6350094A (ja) | 1986-08-20 | 1986-08-20 | 多層回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6350094A true JPS6350094A (ja) | 1988-03-02 |
| JPH0513559B2 JPH0513559B2 (en]) | 1993-02-22 |
Family
ID=16320042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19416786A Granted JPS6350094A (ja) | 1986-08-20 | 1986-08-20 | 多層回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6350094A (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148826A (ja) * | 1994-11-18 | 1996-06-07 | Nec Corp | ポリイミド多層配線基板の製造方法 |
| JPH08213757A (ja) * | 1995-06-26 | 1996-08-20 | Hitachi Chem Co Ltd | 配線板の製造法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101657666B1 (ko) * | 2016-06-09 | 2016-09-19 | 김옥수 | 스카프 |
-
1986
- 1986-08-20 JP JP19416786A patent/JPS6350094A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148826A (ja) * | 1994-11-18 | 1996-06-07 | Nec Corp | ポリイミド多層配線基板の製造方法 |
| JPH08213757A (ja) * | 1995-06-26 | 1996-08-20 | Hitachi Chem Co Ltd | 配線板の製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0513559B2 (en]) | 1993-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |